Steps

Identify which edition governs the project: ANSI/TIA-607-D (2019) is widely referenced, with ANSI/TIA-607-E (May 2024) now the current published revision — confirm which the project spec calls out.
Establish the Primary Bonding Busbar (PBB) and connect it to the building's electrical service ground per the standard's bonding topology.
Install Secondary Bonding Busbars (SBBs) in telecom rooms/spaces and bond them back to the PBB with a Secondary Bonding Conductor (SBC).
Size the SBC as the greater of 6 AWG or the largest conductor bonded to that SBB, per the standard's conductor-sizing rule.
Bond all telecom racks, cable trays, and metallic pathways in the space to the local busbar to maintain a common reference potential.

Known gotchas

TIA-607 terminology changed between editions (e.g., PBB/SBB replaced older TMGB/TGB naming) — verify which terms the project's drawings and spec use so bonding conductor labels aren't mismatched.
Telecom bonding per TIA-607 supplements, but does not replace, NEC-mandated grounding electrode/bonding requirements — coordinate with the electrical engineer of record.

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Design telecom bonding and grounding to TIA-607

Steps

Known gotchas

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